Microelectronics Engineer - Entry to Expert Level (Maryland) Job in Fort Meade, MD

Vacancy No. 1248050 Department National Security Agency/Central Security Service
Salary $86,498.00 to $195,200.00 Grade 7 to 15
Perm/Temp Permanent FT/PT Full-time
Open Date 8/11/2025 Close Date 8/17/2025
Job Link Apply Online Who may apply Public
Locations:
Fort Meade, MD


Summary

With the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission.

Duties

The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer.

1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:
- Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design
- Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL
- Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis
- Understanding and development of assembly specifications in accordance with industry standards
- Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design
- Conduct research including studies, experiments, and investigations on new or alternate methodologies
- Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics

2. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:
- Participate in assembly and fabrication process improvement efforts
- Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment
- Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics

3. A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include:
- Conduct environmental and reliability tests
- High-pin-count Integrated Circuit (IC) design and operation validation
- Parametric testing
- Accelerated testing / qualification / screening
- Develop test plans according to industry and military specifications
- Design and develop test platforms
- Support quality assurance efforts for developed and fielded systems
- Disassembly and sample preparation for physical analysis of ICs for failure analysis
- Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)

Requirements

Conditions of Employment

  • Employment is contingent upon successful completion of a security background investigation and polygraph.

Qualifications

The qualifications listed are the minimum acceptable to be considered for the position.
For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology)
For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.*
*Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics.
----------------------------------------
FOR MICROELECTRONICS PACKAGE DESIGN ENGINEER:
Relevant experience must be in one or more of the following: developing advanced microelectronics systems through the design of integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures using electronic design automation (EDA) tools.

ENTRY/DEVELOPMENTAL
With an Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience.

FULL PERFORMANCE
With a degree in Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience.

SENIOR
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered.

EXPERT
Entry is with a Bachelor's degree plus 10 years of relevant experience, or a Master's degree plus 8 years of relevant experience, or a Doctoral degree plus 6 years of relevant experience. An Associate's degree plus 11 years of relevant experience may also be considered.
-----------------------

FOR MICROELECTRONICS PROCESS ENGINEER:
Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures.

ENTRY/DEVELOPMENTAL
With a professional Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience.

FULL PERFORMANCE
With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience.

SENIOR
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered.

EXPERT
Entry is with a Bachelor's degree plus 10 years of relevant experience, or a Master's degree plus 8 years of relevant experience, or a Doctoral degree plus 6 years of relevant experience. An Associate's degree plus 11 years of relevant experience may also be considered.
--------------------

FOR MICROELECTRONICS TECHNOLOGY ENGINEER:
Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures.

ENTRY/DEVELOPMENTAL
With a professional Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience.

FULL PERFORMANCE
With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience.

SENIOR
Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered.

EXPERT
Entry is with a Bachelor's degree plus 10 years of relevant experience, or a Master's degree plus 8 years of relevant experience, or a Doctoral degree plus 6 years of relevant experience. An Associate's degree plus 11 years of relevant experience may also be considered.

Education

For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology)

For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.*

*Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics.

Additional information

Pay: Salary offers are based on candidates' education level and years of experience relevant to the position and also take into account information provided by the hiring manager/organization regarding the work level for the position.

Salary Range: $86,498 - $195,200 (Entry, Full Performance, Senior, Expert)
Salary range varies by location, work level, and relevant experience to the position.

Training will be provided based on the selectee's needs and experience.

Benefits: NSA offers a comprehensive benefits package.

Work Schedule: This is a full-time position, Monday - Friday, with basic 8hr/day work requirement between 6:00 a.m. and 6:00 p.m. (flexible).

Candidates should be committed to improving the efficiency of the Federal government, passionate about the ideals of our American republic, and committed to upholding the rule of law and the United States Constitution.

Benefits

A career with the U.S. government provides employees with a comprehensive benefits package. As a federal employee, you and your family will have access to a range of benefits that are designed to make your federal career very rewarding. Opens in a new windowLearn more about federal benefits.

Eligibility for benefits depends on the type of position you hold and whether your position is full-time, part-time or intermittent. Contact the hiring agency for more information on the specific benefits offered.

How You Will Be Evaluated

You will be evaluated for this job based on how well you meet the qualifications above.

Microelectronics Package Design Engineer Specialized Skills:
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems
- Designing analog and digital circuits (e.g., FPGAs, ASICs, PCBs)
- Use modeling/simulation to evaluate designs
- Experience using Electronic Design Automation (EDA) tools for ASIC and/or PCB design is required
- Applying engineering principles to perform printed circuit board layout
- Applying engineering principles to perform redistribution layer design and layout
- Applying engineering principles to perform 3D integration design and layout
- Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)

Microelectronics Process Engineer Specialized Skills:
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems is desired
- Understanding of circuit design is desired (e.g., FPGAs, ASICs, PCBs)
- Understanding of modeling/simulation to evaluate designs is desired
- Experience using Electronic Design Automation (EDA) tools is desired
- Applying engineering principles to perform printed circuit board layout is desired
- Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)
- Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is preferred

Microelectronics Technology Engineer Specialized Skills:
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems
- Understanding of digital circuits designs and schematics (e.g., FPGAs, ASICs)
- Understanding of packaging and/or assembling processes for custom microelectronics (ASICs, FPGAs, PCBs) test and evaluation
- Use modeling/simulation to evaluate microelectronics designs for test
- Testing of integrated circuit devices, FPGAs and complex microelectronics systems
- Microelectronics design engineering including analog or digital logic design is desired.
- Experience using Electronic Design Automation (EDA) tools is desired
- Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)
- Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is desired
- Develop test plans for environmental and reliability evaluations
- Understanding of industry and military test and reliability standards is desired

Required Documents

**VETERANS AND TRANSITIONING SERVICE MEMBERS**
Thank you for your service! The National Security Agency (NSA) is part of the Defense Civilian Intelligence Personnel System (DCIPS). All positions at NSA are in the Excepted Service under Title 10, United States Codes (U.S.C.), Section 1601 appointment authority.

Veterans' Preference In accordance with the procedures provided in DoD Instruction 1400.25, Volume 2005, "DoD Civilian Personnel Management System: Defense Civilian Intelligence Personnel System Employment and Placement," NSA applies veterans' preference, as defined by Section 2108 of Title 5, U.S.C., to eligible candidates. If you are claiming veterans' preference, you are required to provide acceptable documentation of your preference eligibility upon application.

Acceptable documentation includes:
- DD-214: "Certificate of Release or Discharge from Active Duty," which shows dates of service and discharge under honorable conditions (Copy 4);
OR
- Certification of Service: A written document on letterhead from the appropriate branch of the armed forces that certifies the service member is expected to be discharged or released from active duty service in the armed forces under honorable conditions not later than 120 days after the date the certification is signed. The certification should include the military service dates, including the expected discharge or release date; AND
- Standard Form 15 (SF-15)
Application for 10-point Veteran Preference (http://www.opm.gov/forms/pdf_fill/sf15.pdf).

If you are claiming a service-connected disability of 30 percent or more, the documentation you provide must specifically demonstrate this level of disability; AND
- VA Letter of Disability (for 10pt and Sole Survivorship rating)

You may obtain a letter from the Department of Veterans Affairs reflecting your level of disability for preference eligibility by visiting a VA Regional Office, contacting a VA call center, or online (https://www.ebenefits.va.gov/).

If you are relying on your education to meet qualification requirements:

Education must be accredited by an accrediting institution recognized by the U.S. Department of Education in order for it to be credited towards qualifications. Therefore, provide only the attendance and/or degrees from schools accredited by accrediting institutions recognized by the U.S. Department of Education.

Failure to provide all of the required information as stated in this vacancy announcement may result in an ineligible rating or may affect the overall rating.

How to Apply

https://apply.intelligencecareers.gov/job-description/1248050

Agency contact information

NSA POC
Address
NSA External Hiring
9800 Savage Road
Fort Meade, MD 20755
US

Next steps

https://apply.intelligencecareers.gov/job-description/1248050


Note: We cannot accept applications on behalf of Federal Agencies. Application instructions are listed within the Job Description.


© 2006-2025, exclusive of U. S. government job opportunity announcements